Bonding method and bonding apparatus
AssigneeUltex Corporation
InventorShigeru SATO
Life of this patent
Estimating the term…
Abstract
A bonding method and a bonding device can bond members together more easily. The bonding device transmits sound energy with a resonator to bond a first member, a second member, and a metal granule group held between the first member and the second member. Surfaces of the members on which bonding is performed may be flat, or may have edges along the peripheries. Bonding may be performed on multiple layers of metal granules separately for each layer or simultaneously for the multiple layers. The metal granule group may be located above or below the first member and the second member for bonding.
Claims10
A bonding method for performing bonding on a target object, the target object including a first member, a second member, and a first metal granule group including one or more metal granules, the method comprising:
- the first metal granule group is held between the first member and the second member in the target object,
- transmitting, with a resonator, sound energy includes applying pressure to the target object to cause at least one metal granule to be in contact with the first member and the second member, and transmitting, with the resonator, the sound energy to the target object to cause the at least one metal granule being in contact with the first member and the second member to be bonded to the first member and the second member.
(canceled)
A bonding method for performing bonding on a target object, the target object including a first member, a second member, and a first metal granule group including one or more metal granules, the method comprising:
- transmitting, with a resonator, sound energy to the target object to bond the first member and the second member with the one or more metal granules, and wherein
- transmitting the sound energy includes applying pressure to the target object, and
- the first member has a surface in contact with the first metal granule group, the second member has a surface in contact with the first metal granule group, and at least a portion of at least one of the surface of the first member or the surface of the second member is inclined with respect to a direction in which at least one of the pressure or the sound energy is applied.
A bonding method for performing bonding on a target object, the target object including a first member, a second member, and a first metal granule group including one or more metal granules, the method comprising:
- transmitting, with a resonator, sound energy to the target object to bond the first member and the second member with the one or more metal granules, and wherein
- the first member and the second member are stacked on each other without the one or more metal granules in the first metal granule group held between the first member and the second member in the target object, and
- transmitting the sound energy includes transmitting the sound energy to bond the first member and the second member stacked on each other with the one or more metal granules in the first metal granule group.
8-14. (canceled)
Dependencies are inferred from the claim text.