Methods of adjusting a tilt between a bonding tool assembly and a support structure assembly of a bonding system, and related bonding systems
AssigneeKulicke and Soffa Industries, Inc.
InventorMatthew Tarabulski
Life of this patent
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Abstract
A bonding system for bonding a semiconductor element to a substrate is provided. The bonding system includes a bonding tool assembly for bonding a semiconductor element to a substrate. The bonding system also includes a support structure assembly for supporting the substrate. The bonding system further includes a vacuum sensor for sensing a vacuum leakage at an interface between the bonding tool assembly and the support structure assembly during contact therebetween. The vacuum sensor is also used in connection with a tilt adjustment between the bonding tool assembly and the support structure assembly.
Claims20
A method of adjusting a tilt between a bonding tool assembly and a support structure assembly of a bonding system, the method comprising the steps of:
- (a) bringing a bonding tool assembly of a bonding system into contact with a support structure assembly of the bonding system;
- (b) sensing a vacuum leakage at an interface between the bonding tool assembly and the support structure assembly;
- and
- (c) adjusting a tilt of at least one of (i) the bonding tool assembly and (ii) the support structure assembly in response to the vacuum leakage sensed in step (b).
A method of adjusting a tilt between a bonding tool assembly and a support structure assembly of a bonding system, the method comprising the steps of:
- (a) bringing a bonding tool assembly of a bonding system into contact with a support structure assembly of the bonding system;
- (b) adjusting a tilt of at least one of (i) the bonding tool assembly and (ii) the support structure assembly according to a tilt profile;
- and
- (c) sensing a vacuum leakage at an interface between the bonding tool assembly and the support structure assembly during step (b).
Dependencies are inferred from the claim text.