Quantum device and method of manufacturing quantum device

A method of manufacturing a quantum device comprising:

• preparing a quantum chip including a substrate having a first surface and a second surface, a quantum bit provided on the first surface, and an electrode electrically connected to the quantum bit and provided on the second surface, the electrode having a longitudinal direction in a direction extending radially from a center of the substrate in a plan view;
• preparing a mounter having a mounting surface on which a peripheral edge of the quantum chip is mounted, the mounter having a linear expansion coefficient different from that of the substrate, and a holder fixed to the mounter, the holder holding a conductor pin and having a linear expansion coefficient different from that of the substrate;
• mounting the peripheral edge of the quantum chip on the mounting surface so that a tip of the conductor pin is in contact with the electrode by inserting a protrusion provided on one of the substrate and the mounting surface into a hole provided on another of the substrate and the mounting surface at a first temperature, the hole having a longitudinal direction in a direction extending radially in plan view;
• and
• cooling the mounter to which the quantum chip and the holder are fixed to a second temperature lower than the first temperature after the mounting.