Back to results
US 2026/0198168 A1Published application
Mechanically Strong Connections for Perovskite-Silicon Tandem Solar Cells
AssigneeSwift Solar Inc.
InventorsTodd Krajewski, Tomas Leijtens
Life of this patent
Estimating the term…
Abstract
Solar cell modules and methods of fabrication are described. In an embodiment, a pair of tandem solar cells are a step surface or trench within the top subcell of a tandem solar cell is at least partially filled with another material such as an insulator support or electrically conductive support to transfer stress away from the absorber layer of the top subcell of the tandem solar cells when stacked or connected with ribbon.
Claims20
A solar cell module comprising:
- a first tandem solar cell including:
- a first lower silicon subcell;
- a first upper perovskite subcell;
- a first step surface including a first step edge adjacent to the first upper perovskite subcell and a first step floor over the first lower silicon subcell;
- a first dielectric layer spanning the first step floor and the first step edge of the first step surface;
- and
- a first electrically conductive support adjacent to the first dielectric layer and at least partially filling the first step surface;
- and
- a second tandem solar cell including:
- a second lower silicon subcell;
- and
- a second upper perovskite subcell;
- wherein a back side of the second tandem solar cell is bonded to a top side of the first tandem solar cell with an electrically conductive bonding material, the electrically conductive bonding material positioned substantially over the first electrically conductive support.
10 more elements
A method for processing a solar cell module comprising:
- patterning a tandem solar cell wafer including a lower silicon subcell and an upper perovskite subcell to form a trench in the upper perovskite subcell;
- applying metal finger electrodes and a busbar to a top side of the tandem solar cell wafer;
- depositing a dielectric layer over the top side of the tandem solar cell wafer, wherein the dielectric layer covers the metal finger electrodes, the busbar and an interior of the trench;
- forming a patterned line opening in the dielectric layer to expose the busbar;
- applying an electrically conductive support to the exposed busbar and along a sidewall of the interior of the trench;
- scribing through the trench to separate a plurality of tandem solar cells;
- and
- bonding a top side of a first tandem solar cell to a back side of a second tandem solar cell with an electrically conductive bonding material.
5 more elements
A method for processing a solar cell module comprising:
- patterning a tandem solar cell wafer including a lower silicon subcell and an upper perovskite subcell to form a trench in the upper perovskite subcell;
- applying metal finger electrodes and a busbar to a top side of the tandem solar cell wafer;
- scribing through the trench to separate a plurality of tandem solar cells;
- depositing a dielectric layer on a first tandem solar cell, wherein the dielectric layer covers the metal finger electrodes, the busbar and an interior of the trench;
- forming a patterned line opening in the dielectric layer to expose the busbar;
- applying an electrically conductive support to the exposed busbar and along a sidewall of the interior of the trench;
- and
- bonding the top side of the first tandem solar cell to a back side of a second tandem solar cell with an electrically conductive bonding material.
5 more elements
A solar cell module comprising:
- a tandem solar cell including:
- a lower silicon subcell;
- a recombination layer on the lower silicon subcell;
- a first patterned line opening through the recombination layer and exposing the lower silicon subcell;
- a junction layer of a first conductivity type spanning over the recombination layer and directly on a portion of the lower silicon subcell, wherein a diode is formed at an interface of the junction layer and the lower silicon subcell;
- an upper perovskite subcell spanning over the junction layer;
- a trench in the upper perovskite subcell, wherein the trench exposes the junction layer;
- and
- an electrically conductive support within the trench and on the junction layer;
- and
- a ribbon or wire bonded to the electrically conductive support of the tandem solar cell with an electrically conductive bonding material, the electrically conductive bonding material positioned directly over the electrically conductive support.
8 more elements
A method for processing a solar cell module comprising:
- forming a patterned line opening in a recombination layer to expose a portion of a lower silicon subcell;
- depositing a junction layer of a first conductivity type over the recombination layer and the exposed portion of the lower silicon subcell within the patterned line opening;
- depositing an upper perovskite subcell;
- patterning the upper perovskite subcell to form a trench that exposes the junction layer over the patterned line opening;
- forming an electrically conductive support in the trench;
- and
- bonding a ribbon or wire to the electrically conductive support with an electrically conductive bonding material.
4 more elements
Dependencies are inferred from the claim text.