Sensor packaging structure, sensor and electronic device

A sensor packaging structure, comprising:

• a housing with one end being provided with an opening;
• a substrate provided over the opening and forming an encapsulation cavity with the housing, a first acoustic hole being provided on the substrate and communicating with the encapsulation cavity;
• a sensing component accommodated in the encapsulation cavity, the sensing component comprising a mounting plate, a sensor chip and a signal processing chip installed side by side on the mounting plate, the sensor chip being electrically connected to the signal processing chip, the sensor chip having a vibration cavity, a second acoustic hole being provided on the mounting plate to communicate the vibration cavity and the encapsulation cavity, and the second acoustic hole being offset from the first acoustic hole;
• and
• a waterproof membrane accommodated in the encapsulation cavity and located between the substrate and the sensing component, the waterproof membrane blocking the first acoustic hole, and the first acoustic hole being inclined toward the second acoustic hole in a direction adjacent to the waterproof membrane to compensate for misalignment between the first acoustic hole and the second acoustic hole.