Photonic communication platform and related architectures, systems and methods

A computing system comprising:

• a photonic interposer comprising a plurality of photonics tiles that are instantiations of a template photonic tile,
• first and second application-specific integrated circuits (ASICs) mounted on the photonic interposer, wherein the first ASIC is coupled with a first photonic tile of the plurality of photonic tiles and the second ASIC is coupled with a second photonic tile of the plurality of photonic tiles;
• and
• a data path placing the first ASIC in communication with the second ASIC, the data path comprising:
• a first die-to-die (D2D) interface, embedded with the first ASIC, comprising a plurality of wires;
• a first plurality of SerDes coupled to the plurality of wires;
• a plurality of optical modulators, coupled with the first plurality of SerDes, formed in the first photonic tile;
• a plurality of optical detectors, coupled with the plurality of optical modulators, formed in the second photonic tile;
• a second plurality of SerDes coupled to the plurality of optical detectors;
• and
• a second D2D interface, embedded with the second ASIC.