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US 2026/0196446 A1Published application
Processing Apparatus and Processing Method
AssigneeTokyo Electron Limited
InventorToshifumi KITAHARA
Life of this patent
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Abstract
Provided is a processing apparatus comprising: a processing chamber; a stage configured to hold a substrate in the processing chamber or a first ring located at a periphery of the stage; a second ring spaced apart from the stage or the first ring by a gap and configured to divide the processing chamber into an upper space and a lower space; and an actuator connected to the second ring and configured to drive the second ring.
Claims13
A processing apparatus comprising:
- a processing chamber;
- a stage configured to hold a substrate in the processing chamber or a first ring located at a periphery of the stage;
- a second ring spaced apart from the stage or the first ring by a gap and configured to divide the processing chamber into an upper space and a lower space;
- and
- an actuator connected to the second ring and configured to drive the second ring.
2 more elements
A processing method performed in a processing apparatus,
- wherein the processing apparatus includes:
- a processing chamber;
- a stage that is configured to hold a substrate in the processing chamber and has a temperature control part that controls a temperature of the substrate or a first ring located at the periphery of the stage;
- a processing gas supply configured to supply a processing gas into the processing chamber;
- a second ring spaced apart from the stage or the first ring by a gap and configured to divide the processing chamber into an upper space and a lower space;
- and
- an actuator connected to the second ring and configured to drive the second ring,
- the method comprising:
- (A) placing the substrate on the stage;
- (B) setting the substrate to a predetermined processing temperature by the temperature control part;
- (C) supplying the processing gas from the processing gas supply to process the substrate;
- and
- (D) driving the driving part to move the second ring and adjust the gap at least during the processing of the substrate.
10 more elements
Dependencies are inferred from the claim text.