Actinic ray-sensitive or radiation-sensitive resin composition, actinic ray-sensitive or radiation-sensitive film, pattern forming method, and method for producing electronic device

An actinic ray-sensitive or radiation-sensitive resin composition comprising:

• an acid-decomposable resin (A);
• and
• the following compound (B) which generates an acid upon irradiation with actinic rays or radiation,
• Compound (B):
• a compound which has the following structural moiety X and the following structural moiety Y and which generates an acid including the following first acidic moiety derived from the structural moiety X and the following second acidic moiety derived from the structural moiety Y upon irradiation with actinic rays or radiation,
• Structural moiety X:
• a structural moiety which is constituted by an anionic moiety A1− and a cationic moiety M1+ and which forms the first acidic moiety represented by HA1 upon irradiation with actinic rays or radiation,
• Structural moiety Y:
• a structural moiety which is constituted by an anionic moiety A2− and a cationic moiety M2+ and which forms the second acidic moiety represented by HA2 upon irradiation with actinic rays or radiation,
• provided that the compound (B) satisfies conditions I and II below:
• Condition I:
• a compound PI obtained by replacing the cationic moiety M1+ in the structural moiety X and the cationic moiety M2+ in the structural moiety Y in the compound (B) with H+ has an acid dissociation constant a1 (pKa) derived from an acidic moiety represented by HA1 obtained by replacing the cationic moiety M1+ in the structural moiety X with H+ and an acid dissociation constant a2 (pKa) derived from an acidic moiety represented by HA2 obtained by replacing the cationic moiety M2+ in the structural moiety Y with H+, and the acid dissociation constant a2 is larger than the acid dissociation constant a1,
• Condition II:
• in the compound (B), the anionic moiety A2− in the structural moiety Y is an anionic moiety including a partial structure represented by a formula (1) below,
• wherein in the formula (1), * represents a bonding site to another atom.