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US 2026/0194809 A1Published application
Substrate, method for manufacturing substrate for manufacturing semiconductor, and method for manufacturing semiconductor substrate
AssigneeJsr Corporation
InventorsShuhei YAMADA, Eiji YONEDA
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Abstract
A substrate includes: a substrate having a thin film on a surface thereof. The thin film includes a group derived from a compound represented by formula (1). In the formula (1), R1 is an n-valent organic group having 1 to 40 carbon atoms, and n is an integer of 1 to 4.
Claims11
A substrate comprising:
- a substrate having a thin film on a surface thereof,
- wherein the thin film comprises a group derived from a compound represented by formula (1):
- wherein in the formula (1),
- R1 is an n-valent organic group having 1 to 40 carbon atoms, and
- n is an integer of 1 to 4.
2 more elements
A method for manufacturing a substrate for manufacturing a semiconductor, comprising:
- bringing a substrate and a compound represented by formula (1) into contact to produce the substrate for manufacturing a semiconductor:
- wherein in the formula (1),
- R1 is an n-valent organic group having 1 to 40 carbon atoms, and
- n is an integer of 1 to 4.
1 more element
Dependencies are inferred from the claim text.