Automation method for thin film measurement and analysis and apparatus for the same

An apparatus for automating thin film measurement and analysis, the apparatus comprising:

• memory storing one or more instructions;
• and
• one or more processors configured to individually or collectively execute the one or more instructions,
• wherein the one or more instructions, when individually or collectively executed by the one or more processors, cause the apparatus to:
• generate a recipe comprising a measurement condition and a thin film analysis model by obtaining information on a material of a thin film;
• perform a primary analysis, using the thin film analysis model, on a result of a primary measurement of the thin film according to the measurement condition;
• based on determining that the thin film analysis model is suitable based on a result of the primary analysis, obtain a final thin film analysis model by updating a parameter of the thin film analysis model using the result of the primary measurement;
• and
• output a physical property value of the thin film by performing a secondary analysis, using the final thin film analysis model, on a result of secondary measurement of the thin film according to the measurement condition.

A method of automating thin film measurement and analysis, the method comprising:

• generating a recipe comprising a measurement condition and a thin film analysis model by obtaining information on a material of a thin film;
• obtaining a primary measurement of the thin film based on the measurement condition;
• obtaining a parameter based on the primary measurement;
• obtaining an error value of the primary measurement by inputting the parameter into the thin film analysis model;
• based on the error value exceeding a predetermined threshold, obtaining an updated error value by generating an adjusted parameter and inputting the adjusted parameter into the thin film analysis model;
• iteratively repeating the obtaining the updated error value until a final error value less than the predetermined threshold is obtained;
• obtaining a final thin film analysis model by updating the thin film analysis model using the adjusted parameter associated with the final error value;
• and
• outputting a physical property value of the thin film by performing a secondary analysis, using the final thin film analysis model, on a result of a secondary measurement of the thin film according to the measurement condition.