Gene sequencing chip, packaging structure, system and method for cleaning and manufacturing thereof, and sequencing method using the same

Abstract

A gene sequencing chip and a package structure thereof, a cleaning method, a production method, and a system. The gene sequencing chip comprises at least one chip body. The chip body comprises: a substrate layer provided with a circuit; at least one electrode layer located on the substrate layer; and at least one protective layer located on the substrate layer and used for keeping the insulativity between the substrate layer and the outside. The protective layer and the electrode layer are not located on a same plane, at least part of the electrode layer is exposed out of the protective layer, and the portion of the electrode layer exposed out of the protective layer comprises a plurality of electrode parts, wherein the plurality of electrode parts are arranged in an array, and DNBs are loaded to the electrode parts to form a sequencing area. Instead of using existing design of molecular hierarchical modification, the gene sequencing chip can be produced using only a conventional semiconductor manufacturing process and on the basis of a conventional semiconductor material; in cooperation with a protective layer, arrayed sites formed by the electrode layer are resistant to corrosion of a biochemical reagent, the structure is more suitable for adsorption and binding of DNA, and the morphology and material still keep original characteristics after repeated use; and the gene sequencing chip can be repeatedly use.

Dependencies are inferred from the claim text.