Adhesive composition and wafer processing tape including the same

A wafer processing method comprising:

• attaching a first surface of a wafer to a carrier;
• attaching a second surface of the wafer, opposite the first surface, to an adhesive composition layer of a wafer processing tape,
• wherein the wafer processing tape comprises the adhesive composition layer and a base film,
• wherein the adhesive composition layer is between the wafer and the base film, wherein the adhesive composition layer comprises a resin, a crosslinking agent, and a first light absorber, and
• wherein the first light absorber includes at least one selected from the group consisting of a benzophenone-based compound, a cyanoacrylate-based compound having a ring structure, a benzotriazole-based compound, and a sterically hindered amine-based compound having a ring structure;
• removing the carrier from the wafer by emitting first ultraviolet light in a direction from the first surface of the wafer toward the second surface of the wafer;
• after removing the carrier, dicing the wafer into individual chips;
• and
• after dicing the wafer, removing the wafer processing tape from the individual chips by emitting second ultraviolet light in a direction from the second surface of the wafer toward the first surface of the wafer.

A wafer processing tape, comprising:

• a base film;
• an adhesive composition layer configured to attach to a wafer;
• and
• an adhesive layer between the base film and the adhesive composition layer, wherein the adhesive layer is configured to attach the adhesive composition layer to the base film,
• wherein the adhesive composition layer comprises an acrylate-based resin, an isocyanate-based crosslinking agent, a first light absorber, and a second light absorber, wherein the first light absorber and the second light absorber include at least one selected from the group consisting of a benzophenone-based compound, a cyanoacrylate-based compound having a ring structure, a benzotriazole-based compound, and a sterically hindered amine-based compound having a ring structure, and the first light absorber and the second light absorber are different from each other.