Wafer mount and method of manufacturing wafer mount
AssigneeNGK Insulators, Ltd.
InventorsNatsuki HIRATA, Shinya YOSHIDA, Toshiki KONDO
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Abstract
A wafer mount to which a wafer is mounted and fixed includes: an electrostatic chuck including a ceramics base body including a wafer mounting surface and an ESC electrode and a heater electrode each buried inside the ceramics base body; a cooling plate made of metal; and a bonding sheet made of resin to bond the electrostatic chuck and the cooling plate, wherein a bonding surface of the electrostatic chuck bonded to the bonding sheet has an uneven structure made up of one type or plural types of unit structures, and in the uneven structure, a protrusion is provided at a pitch equal to or larger than 100 μm and equal to or smaller than 300 μm.
Claims20
A wafer mount to which a wafer is mounted and fixed, comprising:
- an electrostatic chuck including:
- a ceramics base body including a wafer mounting surface;
- and
- an ESC electrode and a heater electrode each buried inside the ceramics base body;
- a cooling plate made of metal;
- and
- a bonding sheet made of resin sandwiched between the electrostatic chuck and the cooling plate to bond the electrostatic chuck and the cooling plate, wherein
- a bonding surface of the electrostatic chuck bonded to the bonding sheet has an uneven structure made up of one type or plural types of unit structures, and
- in the uneven structure, a protrusion is provided at a pitch equal to or larger than 100 μm and equal to or smaller than 300 μm, and the bonding surface includes a distal end surface of the protrusion.
A method of manufacturing a wafer mount to which a wafer is mounted and fixed, comprising steps of:
- a) step of preparing an electrostatic chuck including a ceramics base body having a wafer mounting surface and an ESC electrode and a heater electrode each buried inside the ceramics base body;
- and
- b) bonding the electrostatic chuck and a cooling plate made of metal by a bonding sheet made of resin sandwiched therebetween, wherein
- the step a) includes the step of:
- a-1) alternately and periodically providing a protrusion and a recess to a bonding surface of the electrostatic chuck bonded to the bonding sheet to provide an uneven structure,
- the step a-1) is at least one of:
- a first step of reducing variation in a temperature distribution occurring in the mounting surface;
- and
- a second step of making the recess absorb thickness variation when the bonding sheet includes thickness variation, and
- in the step b), a distal end surface of the protrusion is included in the bonding surface.
Dependencies are inferred from the claim text.