Method of forming an electromagnetic interference (emi) shielding film and apparatus for effecting the same

A deposition apparatus comprising:

• a chamber enclosure;
• a package tray configured for disposition of at least one semiconductor package thereupon, wherein the package tray comprises a tray base portion, a tray mesa portion which protrudes upward from the tray base portion and laterally enclosing at least one recessed region, and at least one frame-shaped support portion, wherein each of the at least one frame-shaped support portion is located within a respective recessed region selected from the at least one recessed region and protrudes upward from the tray base portion;
• a vacuum pump connected to an exhaust region of the chamber enclosure;
• and
• a reactant gas supply manifold configured to supply a reactant gas to a gas inlet side of the chamber enclosure and to provide a reaction region within the chamber enclosure.