2d semiconductor device and fabrication method therefor
AssigneeNanjing University
InventorsMaguang ZHU, Yan BAI, Lingyu ZHANG, Yifu SUN, Kaiyue HE
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AssigneeNanjing University
InventorsMaguang ZHU, Yan BAI, Lingyu ZHANG, Yifu SUN, Kaiyue HE
Estimating the term…
The present disclosure discloses a 2D semiconductor device and a fabrication method therefor. The device includes a substrate, a two-dimensional (2D) semiconductor material layer, and a gate structure including a gate dielectric layer and a gate electrode layer, where the gate dielectric layer includes a portion covered by a bottom of the gate electrode layer and portions not covered by the bottom of the gate electrode layer, and the portions not covered by the bottom of the gate electrode layer extend outward along the 2D semiconductor material layer; the portions of the gate dielectric layer not covered by the bottom of the gate electrode layer and both sides of the gate electrode layer are covered with spacers; support layers are disposed on surfaces of the spacers; and source and drain metal contact layers vertically penetrate through the support layers, the spacers, the 2D semiconductor material layer, and the substrate.
A 2D semiconductor device, comprising a substrate, a two-dimensional (2D) semiconductor material layer disposed on the substrate, and a gate structure disposed on the 2D semiconductor material layer, the gate structure comprising a gate dielectric layer and a gate electrode layer above the gate dielectric layer, wherein the gate dielectric layer comprises a portion covered by a bottom of the gate electrode layer and portions not covered by the bottom of the gate electrode layer, and the portions not covered by the bottom of the gate electrode layer extend outward along a surface of the 2D semiconductor material layer, respectively;
Dependencies are inferred from the claim text.