Semiconductor memory device and method for forming the same
AssigneeWinbond Electronics Corp.
InventorsJian-Sheng CHEN, Ming-Hung LAI, Yu-Shu CHENG, Kuo-Lung LIN
Life of this patent
Estimating the term…
Loading patent…
AssigneeWinbond Electronics Corp.
InventorsJian-Sheng CHEN, Ming-Hung LAI, Yu-Shu CHENG, Kuo-Lung LIN
Estimating the term…
A semiconductor memory device is provided and includes a substrate and stacked structures disposed on a memory cell region of the substrate. Each stacked structure includes a gate stack, a capping layer stack, first and second spacers, and a first protection layer. The capping layer stack is disposed on the gate stack. The first gate spacer includes a vertical portion covering sidewalls of the gate stack and the capping layer stack and a horizontal portion extending laterally from the bottom of the vertical portion. The second spacer covers the sidewall of the vertical portion. The first protection layer covers the upper surface of the capping layer stack and a sidewall of the horizontal portion.
A semiconductor memory device, comprising:
A method for forming a semiconductor memory device, comprising:
Dependencies are inferred from the claim text.