Electrically conductive gasket and electromagnetic wave shielding device applying same

An electromagnetic wave shielding device, which surrounds a semiconductor chip mounted on a circuit board to shield electromagnetic waves, the electromagnetic wave shielding device comprising:

• a metal shield case having an opening in a top surface thereof and provided with a flange along an edge of the opening;
• and
• an electrically conductive gasket attached to a top surface of the flange,
• wherein the electrically conductive gasket comprises the electrically conductive member, and an electrically conductive film provided as a curable adhesive layer having elasticity, which adheres to the electrically conductive member by curing,
• the electrically conductive film is bent in a curved shape at each of both sides of the electrically conductive gasket in a width direction so that the adhesive layer is disposed inside to provide a bending portion having one inner space extending in a longitudinal direction of the electrically conductive gasket,
• the adhesive layers adhere to each other at a portion at which the electrically conductive films overlap to face each other except for the bending portion to provide a support layer, wherein a support part is provided by the portion, at which the electrically conductive films overlap each other, and the support layer,
• an opening passing through the electrically conductive gasket in a thickness direction is defined in the support part,
• a maximum height of the bending portion is higher than a maximum height of the support part,
• when each of the objects presses the gasket, the gasket is in contact with elastic contact with the object due to elastic restoring force of the bending portion, and
• a surface of the semiconductor chip is exposed to the outside through the opening of the gasket and the opening of the shield case.