Resin sheet, laminate, metal clad laminate, printed wiring board, and semiconductor package

Abstract

Provided is a resin sheet which withstands adsorption and transportation by a vacuum adsorption pad for transportation, has low thermal expansion, and has a relative dielectric constant (Dk) of 2.50 to 3.30 in a high frequency band of 10 GHz band or more, and a dielectric dissipation factor (Df) of 0.0020 or less in a high frequency band of 10 GHz band or more. In addition, provided are a laminate, a printed wiring board, and a semiconductor package produced using the resin sheet. The resin sheet is specifically a resin sheet including a resin component (A), and an inorganic filler (B), in which the component (A) contains an elastomer (A1) having a number-average molecular weight of 10,000 or more, a content of the component (B) is 25 to 70 volume % based on a total amount of the resin sheet, and a breaking energy is 0.1 mJ/mm3 or more.

Dependencies are inferred from the claim text.