Scalable surface-emitting lasers with a uniform fundamental mode
AssigneeTopolight, Inc.
InventorsRushin Contractor, Daniel Klawson
Life of this patent
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Abstract
A VCSEL-pumped uniform-field cavity (VPUFC) includes a substrate, one or more vertical cavity surface emitting lasers (VCSEL) bonded to the substrate and a heat sink wafer disposed proximate an emitting surface of the VCSEL. The one or more VCSEL is disposed between the substrate and the heat sink wafer. A uniform field cavity (UFC) is optically coupled to the VCSEL(s) through the heat sink wafer, which is disposed between the VCSEL(s) and UFC. The one or more VCSEL is configured to optically pump the UFC.
Claims32
A VCSEL-pumped uniform-field cavity (VPUFC), comprising:
- a substrate;
- one or more vertical cavity surface emitting laser (VCSEL) bonded to the substrate;
- a heat sink wafer disposed proximate an emitting surface of the VCSEL, whereby the one or more VCSEL is disposed between the substrate and the heat sink wafer;
- a uniform field cavity (UFC) optically coupled to the one or more VCSEL through the heat sink wafer, wherein the heat sink wafer is disposed between the one or more VCSEL and the uniform field cavity, wherein the one or more VCSEL is configured to optically pump the UFC.
A VCSEL-pumped uniform-field cavity (VPUFC) system, comprising:
- a VPUFC having a substrate, one or more vertical cavity surface emitting laser (VCSEL) disposed on the substrate, a heat sink wafer disposed proximate an emitting surface of the VCSEL, whereby the one or more VCSEL is disposed between the substrate and the heat sink wafer;
- a uniform field cavity (UFC) optically coupled to the one or more VCSEL through the heat sink wafer, wherein the heat sink wafer is disposed between the one or more VCSEL and the uniform field cavity, wherein the one or more VCEL is configured to optically pump the UFC;
- and
- one or more optical components configured to receive an optical output of the VPUFC.
A method for manufacturing a VCSEL-pumped uniform-field cavity (VPUFC), comprising:
- bonding one or more vertical cavity surface emitting laser (VCSEL) bonded to a substrate;
- disposing a heat sink wafer proximate an emitting surface of the VCSEL, whereby the one or more VCSEL is disposed between the substrate and the heat sink wafer;
- optically coupling a uniform field cavity (UFC) to the one or more VCSEL through the heat sink wafer, wherein the heat sink wafer is disposed between the one or more VCSEL and the uniform field cavity, wherein the one or more VCEL is configured to optically pump the UFC.
Dependencies are inferred from the claim text.