Imprint method
AssigneeUnited Microelectronics Corp.
InventorsYi Lin Tsai, Chih-Hsien Tang
Life of this patent
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AssigneeUnited Microelectronics Corp.
InventorsYi Lin Tsai, Chih-Hsien Tang
Estimating the term…
An imprint method including the following steps is provided. Providing a first master mold including a first protruding pattern and a second protruding pattern. Providing a second master mold including a third protruding pattern. Performing a first imprint step on a first photoresist layer formed on a replica mold by using the first master mold. Performing a first etching step on the replica mold to form a first recessed portion and a second recessed portion. Performing a second imprint step on a second photoresist layer formed on the replica mold by using the second master mold. Performing a second etching step on the replica mold to form a third recessed portion overlapping the first recessed portion. Performing a third imprint step on a third photoresist layer formed on a substrate by using the replica mold. Performing a third etching step on the substrate to form a desired pattern.
An imprint method, including:
Dependencies are inferred from the claim text.