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US 2026/0186052 A1Published application
Fault injection and deterministic repair for debug of packaged semiconductor dies
AssigneeIntel Corporation
InventorsRakesh KANDULA, Dror ZILBERMAN, R Selvakumar RAJAGOPAL, Mahesh Deepak BENDRE, Idan SHALEV
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Abstract
Devices and methods for identifying failures in multichip packages are provided. Additionally, devices and methods for repairing identified failures in multichip packages are provided.
Claims20
A method comprising:
- selecting a multichip package assembly, wherein the multichip package assembly comprises a first die and a second die, wherein the first die comprises transmit circuitry and the second die comprises receive circuitry, wherein the transmit circuitry is electrically coupled to the receive circuitry, and wherein the receive circuitry comprises failing lane registers,
- injecting an error into a selected lane of the transmit circuitry, determining whether a failing lane register of the failing lane registers has correctly reported a failing lane.
A method comprising:
- selecting a multichip package assembly, wherein the multichip package assembly comprises a first die and a second die, wherein the first die comprises first transmit circuitry and the second die comprises first receive circuitry, wherein the first die comprises a second transmit circuitry, wherein the second die comprises second receive circuitry;
- wherein the first transmit circuitry is electrically coupled to the first receive circuitry;
- rerouting a first signal path from the first transmit circuitry to the second transmit circuitry;
- and
- rerouting a second signal path from the second receive circuitry to the first receive circuitry.
2 more elements
At least one machine-readable storage medium comprising non-transitory instructions, that when executed by a processor, cause a device to:
- on a selected multichip package assembly, wherein the multichip package assembly comprises a first die and a second die, wherein the first die comprises first transmit circuitry and the second die comprises first receive circuitry, wherein the first die comprises a second transmit circuitry, wherein the second die comprises second receive circuitry, and wherein a first lane comprises the first transmit circuitry and the first receive circuitry, determine that the first lane comprises a fault;
- reroute a first signal path from the first transmit circuitry to the second transmit circuitry;
- and
- reroute a second signal path from the second receive circuitry to the first receive circuitry.
1 more element
Dependencies are inferred from the claim text.