Condensing panel assembly and heat dissipation device including same
AssigneeKmw Inc.
InventorsDuk Yong KIM, Kyo Sung JI, Min Sik PARK, Chi Back RYU, Jin Kook SEO, In Hwa CHOI
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AssigneeKmw Inc.
InventorsDuk Yong KIM, Kyo Sung JI, Min Sik PARK, Chi Back RYU, Jin Kook SEO, In Hwa CHOI
Estimating the term…
The present invention relates to a condensing panel assembly and a heat dissipation device including same, and, particularly, the heat dissipation device comprises an evaporation panel assembly in which a reservoir storing a refrigerant capable of phase change according to temperature is formed and at least a portion of a lower surface thereof is in surface thermal contact with heat-generating surfaces of heating elements; and a plurality of condensing panel assemblies coupled to the evaporation panel assembly to communicate with the reservoir and configured to release heat transferred from the heating elements through heat exchange with outside air (outdoor air).
A condensing panel assembly comprising:
A condensing panel assembly comprising:
21-52. (canceled)
Dependencies are inferred from the claim text.