Substrate processing appartus

An apparatus for processing a substrate, the apparatus comprising:

• a chamber body having a treatment space for processing a substrate;
• a support unit for supporting a substrate in the treatment space;
• a fluid supply unit for supplying a fluid to the treatment space;
• an exhaust unit for exhausting the fluid in the treatment space;
• and
• a filler member disposed below the substrate supported by the support unit in the treatment space,
• wherein the treatment space is defined by an upper surface, a bottom surface, and a side surface,
• the bottom surface has:
• a lower central region in which a first supply port is formed to supply the fluid supplied by the fluid supply unit to the treatment space;
• a lower edge region disposed outside the lower central region and positioned higher than the lower central region;
• and
• a lower connection region positioned between the lower central region and the lower edge region,
• when viewed from above, the first supply port overlaps the filler member, and
• the bottom surface includes a vortex generator that generates a vortex from the fluid while the fluid introduced between the filler member and the bottom surface flows toward the side surface.

An apparatus for processing a substrate, the apparatus comprising:

• a lower body;
• an upper body combined with the lower body to form a treatment space for processing a substrate;
• a filler member disposed below the substrate supported by a support unit supporting the substrate in the treatment space;
• a holder installed above the filler member and supporting the substrate loaded into the treatment space;
• and
• a support pin installed on an upper surface of the filler member to support the substrate during substrate processing,
• wherein the treatment space is defined by an upper surface, a bottom surface, and a side surface,
• the upper surface has:
• an upper central region positioned at a center;
• and
• an upper edge region positioned outside the upper central region, and
• the upper edge region is provided higher than the upper central region,
• the bottom surface has:
• a lower central region in which a first supply port for supplying a supercritical fluid to the treatment space is formed;
• a lower edge region disposed outside the lower central region and positioned higher than the lower central region;
• and
• a lower connection region positioned between the lower central region and the lower edge region,
• when viewed from above, the first supply port overlaps the filler member, and
• the connection region overlaps the substrate supported by the support unit when viewed from above, and
• the connection region includes a vortex generator that generates a vortex from the supercritical fluid while the supercritical fluid introduced between the filler member and the lower central region flows toward the lower edge region, and
• the vortex generator includes stepped steps to increase a height in a direction from the lower central region toward the lower edge region.