Dual-curing semi-structural adhesive composition and preparation method thereof

Abstract

The present invention provides a dual-curing semi-structural adhesive composition and a preparation method therefor. Specifically, the dual-curing semi-structural adhesive composition includes: an acrylic copolymer containing an acryloxy benzophenone copolymerized unit and an epoxidized acrylic copolymerized unit; an epoxy resin; a polyol; and a cationic photoinitiator. When the dual-curing semi-structural adhesive composition according to the technical solution of the present invention is used to adhere an adherend, the dual-curing semi-structural adhesive composition can immediately produce strong initial tack through primary curing by means of ultraviolet radiation, thus preventing the adherend from warping or sliding, and can produce firm final cured adhesion by means of subsequent cationic secondary curing.

Dependencies are inferred from the claim text.