Polycyclic-olefinic polymers containing epoxy functionality for forming low-loss films having improved thermal properties
AssigneePromerus, LLC
InventorPRAMOD KANDANARACHCHI
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AssigneePromerus, LLC
InventorPRAMOD KANDANARACHCHI
Estimating the term…
Embodiments in accordance with the present invention encompass polymers of a variety of polycycloolefinic monomers at least one of which monomer contains an epoxy functional group. In further aspect of this invention there is provided an embodiment encompassing compositions containing the polymers of this invention, an epoxy crosslinker, a thermal acid generator and one or more suitable additives. The compositions of this invention can be formed into a variety of three-dimensional insulating articles upon exposure to suitable high temperature, such as for example films. The objects formed from the compositions of this invention exhibit hitherto unattainable low dielectric constant and low-loss properties, and very high thermal properties. The compositions of this invention may additionally contain one or more organic or inorganic filler materials, which provide improved thermo-mechanical properties in addition to very low dielectric properties. The compositions of this invention are useful in various applications, including as insulating materials in millimeter wave radar antennas, among others.
A polymer comprising:
A composition comprising:
The composition according to claim 11, wherein the third repeat unit of the polymer is derived from the monomer of formula (III) selected from the group consisting of
Dependencies are inferred from the claim text.