Curing agent and use thereof
AssigneeShikoku Chemicals Corporation
InventorsRyosuke SHIOIRI, Kazunori AOKI, Takeshi KUMANO
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Abstract
The present invention provides a curing agent containing a thiol compound represented by formula (I) and use thereof. Specifically, the present invention provides a curing agent containing a thiol compound represented by formula (I), a resin composition containing the curing agent and an epoxy compound, a resin composition containing the curing agent and an ene compound having a carbon-carbon double bond in the molecule, and adhesives and sealants containing these resin compositions. The present invention relates to a curing agent containing a thiol compound represented by formula (I), a resin composition containing the curing agent, an epoxy compound, and the like, and use of the resin composition.
Claims7
A curing agent comprising a thiol compound represented by formula (I):
Dependencies are inferred from the claim text.