Method for transferring a security element onto a target substrate

Abstract

A method for transferring a security element onto a target substrate, includes: providing the security element; applying the security element onto the target substrate; irradiating a radiation-curable adhesive layer from the security element side to cure the radiation-curable adhesive layer, as a result of which the security element is permanently bonded to the target substrate, wherein the security element is opaque to the irradiation in an effect region and transparent to the irradiation in at least one transparency element. For the irradiation from the security element side, a plurality of transparency elements are arranged distributed in the security element so that a plurality of cured partial areas of the adhesive layer are created during the irradiation through the transparency elements, these partial areas being separated from one another by an uncured partial area of the adhesive layer. The plurality of transparency elements comprise a plurality of transparent raster elements.

Dependencies are inferred from the claim text.