Security element transfer material for transferring security elements having a micro-optical authenticity feature and method for producing said security element transfer material

A method of producing a security element transfer material having a security element layer composite and a temporary carrier which is bonded extricably to the security element layer composite, wherein the security element layer composite has a layer having a first microoptical arrangement having a multitude of focusing elements, a layer having a second microoptical arrangement having a multitude of micromotif elements, and a permanent carrier substrate between the layers having the first and second microoptical arrangements, wherein the first and second microoptical arrangements interact to create an optical effect, and wherein the method has the following steps:

• (1) producing the first microoptical arrangement by
• (a) applying an embossing varnish having a refractive index n>1.55, to a surface of the temporary carrier, wherein the embossing varnish layer is bonded extricably to the temporary carrier,
• embossing a focusing structure into the embossing varnish layer, and
• laminating the permanent carrier substrate onto the focusing structure by means of a laminating varnish having a refractive index n<1.45, wherein the laminating varnish layer, at the interface to the embossing varnish layer, in creating the focusing elements, forms a structure complementary to the focusing structure and bonds the permanent carrier substrate to the embossing varnish layer,
• or by
• (b) applying an embossing varnish having a refractive index n<1.45, to a surface of the permanent carrier substrate, wherein the embossing varnish layer is bonded inextricably to the permanent carrier substrate,
• inversely embossing a focusing structure into the embossing varnish layer, and
• laminating the temporary carrier onto the inverse focusing structure by means of a laminating varnish having a refractive index n>1.55, wherein the laminating varnish layer, at the interface to the embossing varnish layer, in creating the focusing elements, forms a structure complementary to the inverse focusing structure and is bonded inextricably to the embossing varnish layer, but extricably to the temporary carrier,
• (2) producing the second microoptical arrangement by forming the micromotif elements on the surface of the permanent carrier substrate remote from the temporary carrier,
• (3) optionally coating part or all of the area of the second microoptical arrangement with at least one further layer,
• (4) applying a transfer adhesive layer to the second microoptical arrangement and/or the at least one further layer, and
• (5) incising the outline shapes of the security elements to be transferred, wherein
• the temporary carrier used in step (1) is a carrier layer composite consisting of a first temporary carrier substrate and a second temporary carrier substrate that are inextricably adhesive-bonded by means of an adhesive layer, or
• the temporary carrier used in step (1) is a first carrier substrate, and, prior to step (5), the first carrier substrate is inextricably adhesive-bonded to a second carrier substrate for production of a carrier layer composite, and wherein
• in step (5), at least the second temporary carrier substrate is not cut, such that the temporary carrier can be separated off as a complete carrier layer composite.

A method of producing a security element transfer material having a security element layer composite and a temporary carrier which is bonded extricably to the security element layer composite, wherein the security element layer composite has a layer having a first microoptical arrangement having a multitude of focusing elements, a layer having a second microoptical arrangement having a multitude of micromotif elements, and a permanent carrier substrate between the layers having the first and second microoptical arrangements, wherein the first and second microoptical arrangements interact to create an optical effect, and wherein the method has the following steps:

• (1) producing the first microoptical arrangement by
• (a) applying an embossing varnish having a refractive index n<1.45, to a surface of the temporary carrier, wherein the embossing varnish layer is bonded extricably to the temporary carrier,
• inversely embossing a focusing structure into the embossing varnish layer, and
• laminating the permanent carrier substrate onto the inverse focusing structure by means of a laminating varnish having a refractive index n>1.55, wherein the laminating varnish layer, at the interface to the embossing varnish layer, in creating the focusing elements, forms a structure complementary to the inverse focusing structure and bonds the permanent carrier substrate inextricably to the embossing varnish layer,
• or by
• (b) applying an embossing varnish having a refractive index n>1.55, to a surface of the permanent carrier substrate, wherein the embossing varnish layer is bonded inextricably to the permanent carrier substrate,
• embossing a focusing structure into the embossing varnish layer, and
• laminating the temporary carrier onto the focusing structure by means of a laminating varnish having a refractive index n<1.45, wherein the laminating varnish layer, at the interface to the embossing varnish layer, in creating the focusing elements, forms a structure complementary to the focusing structure and is bonded inextricably to the embossing varnish layer, but extricably to the temporary carrier,
• (2) producing the second microoptical arrangement by forming the micromotif elements on the surface of the permanent carrier substrate remote from the temporary carrier,
• (3) optionally coating part or all of the area of the second microoptical arrangement with at least one further layer,
• (4) applying a transfer adhesive layer to the second microoptical arrangement and/or the at least one further layer, and
• (5) incising the outline shapes of the security elements to be transferred, wherein
• the temporary carrier used in step (1) is a carrier layer composite consisting of a first temporary carrier substrate and a second temporary carrier substrate that are inextricably adhesive-bonded by means of an adhesive layer, or
• the temporary carrier used in step (1) is a first carrier substrate, and, prior to step (5), the first carrier substrate is inextricably adhesive-bonded to a second carrier substrate for production of a carrier layer composite, and wherein
• in step (5), at least the second temporary carrier substrate is not cut, such that the temporary carrier can be separated off as a complete carrier layer composite.

A method of producing a security element transfer material having a security element layer composite and a temporary carrier in the form of a carrier layer composite which is bonded extricably to the security element layer composite, wherein the security element layer composite has a layer having a first microoptical arrangement having a multitude of focusing elements, a layer having a second microoptical arrangement having a multitude of micromotif elements, and a permanent carrier substrate between the layers having the first and second microoptical arrangements, wherein the first and second microoptical arrangements interact to create an optical effect, and wherein the method has the following steps:

• (1) producing the first microoptical arrangement by
• (a) applying an embossing varnish to a surface of a temporary carrier substrate, wherein the embossing varnish layer, in forming the temporary carrier composite, is bonded inextricably to the temporary carrier substrate,
• inversely embossing a focusing structure into the embossing varnish layer, and
• laminating the permanent carrier substrate onto the inverse focusing structure by means of a laminating varnish, wherein the laminating varnish layer, at the interface to the embossing varnish layer, in creating the focusing elements, forms a structure complementary to the inverse focusing structure and is bonded inextricably to the permanent carrier substrate and extricably to the embossing varnish layer,
• or by
• (b) applying an embossing varnish to a surface of a permanent carrier substrate,
• embossing a focusing structure into the embossing varnish layer for creation of the focusing elements, and
• laminating a temporary carrier substrate onto the focusing structure by means of a laminating varnish, wherein the laminating varnish layer, at the interface to the embossing varnish layer, forms a structure complementary to the focusing structure and, in forming the temporary carrier composite, is bonded inextricably to the temporary carrier substrate and extricably to the embossing varnish layer,
• (2) producing the second microoptical arrangement by forming the micromotif elements on the surface of the permanent carrier substrate remote from the temporary carrier layer composite,
• (3) optionally coating part or all of the area of the second microoptical arrangement with at least one further layer,
• (4) applying a transfer adhesive layer to the second microoptical arrangement and/or the at least one further layer, and
• (5) incising outline shapes of the security elements to be transferred without cutting the temporary carrier substrate, such that the temporary carrier can be separated off as a complete carrier layer composite.

A security element transfer material having a security element layer composite and a temporary carrier bonded extricably to the security element layer composite, wherein

• the security element layer composite has a layer having a first microoptical arrangement having a multitude of focusing elements, a layer having a second microoptical arrangement having a multitude of micromotif elements, and a permanent carrier substrate between the layer having the first microoptical arrangement and the layer having the second microoptical arrangement, and a transfer adhesive layer as an outer layer of the security element layer composite, where the first the second microoptical arrangement interact to create an optical effect, and
• the temporary carrier has a carrier layer composite consisting of a first temporary carrier substrate and a second temporary carrier substrate that are inextricably bonded by means of an adhesive layer, and wherein
• the first microoptical arrangement consists of
• (a) a layer of an embossing varnish having a refractive index n>1.55, which is bonded extricably to the temporary carrier and into which a focusing structure is embossed, and
• a layer of a laminating varnish having a refractive index n<1.45, which is bonded inextricably to the embossing varnish layer and to the permanent carrier substrate and which has a structure complementary to the focusing structure at the interface to the embossing varnish layer, such that the interface forms focusing elements,
• or of
• (b) a layer of an embossing varnish having a refractive index n<1.45, which is bonded inextricably to the permanent carrier substrate and into which an inverse focusing structure is embossed, and
• a layer of a laminating varnish having a refractive index n>1.55, which is bonded inextricably to the embossing varnish layer and extricably to the temporary carrier and which has a structure complementary to the inverse focusing structure at the interface to the embossing varnish layer, such that the interface forms focusing elements,
• wherein outline shapes of the security elements to be transferred are precut in the security element layer composite and cuts do not penetrate at least into the second temporary carrier substrate, such that the temporary carrier can be separated off as a complete carrier layer composite.

A security element transfer material having a security element layer composite and a temporary carrier bonded extricably to the security element layer composite, wherein

• the security element layer composite has a layer having a first microoptical arrangement having a multitude of focusing elements, a layer having a second microoptical arrangement having a multitude of micromotif elements, and a permanent carrier substrate between the layer having the first microoptical arrangement and the layer having the second microoptical arrangement, and a transfer adhesive layer as an outer layer of the security element layer composite, where the first and second microoptical arrangements interact to create an optical effect, and
• the temporary carrier has a carrier layer composite consisting of a first temporary carrier substrate and a second temporary carrier substrate that are inextricably bonded by means of an adhesive layer, and wherein
• the first microoptical arrangement consists of
• (a) a layer of an embossing varnish having a refractive index n<1.45, which is bonded extricably to the temporary carrier and into which an inverse focusing structure is embossed, and
• a layer of a laminating varnish having a refractive index n>1.55, which is bonded inextricably to the embossing varnish layer and to the permanent carrier substrate and which has a structure complementary to the inverse focusing structure at the interface to the embossing varnish layer, such that the interface forms focusing elements,
• or of
• (b) a layer of an embossing varnish having a refractive index n>1.55, which is bonded inextricably to the permanent carrier substrate and into which a focusing structure is embossed, and
• a layer of a laminating varnish having a refractive index n<1.45, which is bonded inextricably to the embossing varnish layer and extricably to the temporary carrier and which has a structure complementary to the focusing structure at the interface to the embossing varnish layer, such that the interface forms focusing elements,
• wherein outline shapes of the security elements to be transferred are precut in the security element layer composite and cuts do not penetrate at least into the second temporary carrier substrate, such that the temporary carrier can be separated off as a complete carrier layer composite.

A security element transfer material having a security element layer composite and a temporary carrier bonded extricably to the security element layer composite, wherein

• the security element layer composite has a layer having a first microoptical arrangement having a multitude of focusing elements, a layer having a second microoptical arrangement having a multitude of micromotif elements, a permanent carrier substrate between the layer having the first microoptical arrangement and the layer having the second microoptical arrangement, and a transfer adhesive layer as an outer layer of the security element layer composite, where the first microoptical arrangement and the second microoptical arrangement interact to create an optical effect, and
• the temporary carrier has a temporary carrier substrate and a temporary varnish layer on one surface of the temporary carrier substrate, wherein the temporary carrier substrate and the temporary varnish layer are bonded inextricably to one another to form a carrier layer composite, and the temporary varnish layer is either (a) a layer of an embossing varnish into which an inverse focusing structure has been embossed, or (b) a layer of a laminating varnish, and
• the first microoptical arrangement
• (a) when the temporary varnish layer is a layer of an embossing varnish into which an inverse focusing structure is embossed, consists of a layer of a laminating varnish which is bonded inextricably to the permanent carrier material and extricably to the temporary embossing varnish layer and which has, at the interface to the temporary embossing varnish layer, a structure which is complementary to the inverse focusing structure and forms the focusing elements,
• or
• (b) when the temporary varnish layer is a layer of a laminating varnish, consists of a layer of an embossing varnish which is bonded inextricably to the permanent carrier substrate and extricably to the temporary laminating varnish layer and into which a focusing structure is embossed, which forms the focusing elements,
• wherein outline shapes of the security elements to be transferred are precut in the security element layer composite and cuts do not penetrate at least into the temporary carrier substrate, such that the temporary carrier can be separated off as a complete carrier layer composite.