Back to results
US 2026/0184074 A1Published application
Liquid ejecting head and liquid ejecting apparatus
AssigneeSeiko Epson Corporation
InventorsIchiro YONEYAMA, Haruhisa UEZAWA, Shuichi KOGANEHIRA, Kenji SATO
Life of this patent
Estimating the term…
Abstract
A liquid ejecting head includes: a first flow path that communicates with one or more nozzles among a plurality of nozzles; a first bonding portion A that defines an inner wall of the first flow path and that is provided to surround the first flow path; a first bonding portion B that is provided to surround the first bonding portion A; and a first detection portion A for detecting a state in which liquid passes beyond the first bonding portion A but does not pass beyond the first bonding portion B.
Claims11
A liquid ejecting head comprising:
- a plurality of nozzles configured to eject liquid;
- a first flow path that communicates with one or more nozzles among the plurality of nozzles;
- a first bonding portion A that defines an inner wall of the first flow path and that is provided to surround the first flow path;
- a first bonding portion B that is provided to surround the first bonding portion A;
- and
- a first detection portion A for detecting a state in which the liquid passes beyond the first bonding portion A but does not pass beyond the first bonding portion B.
3 more elements
Dependencies are inferred from the claim text.