Substrate processing apparatus including ultrasonic nozzle and method for driving the same
AssigneeSemes Co., Ltd.
InventorsIe Goo YOON, Soon Kab KWON
Life of this patent
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AssigneeSemes Co., Ltd.
InventorsIe Goo YOON, Soon Kab KWON
Estimating the term…
A substrate processing apparatus with improved cleaning efficiency is provided. The substrate processing apparatus includes: a support member configured to support a substrate; a chemical solution supplier configured to supply chemical solution to the substrate; a sonic oscillator including an ultrasonic nozzle; a home port provided on one side of the support member and configured to accommodate the ultrasonic nozzle in a standby state; and a controller configured to control the support member, the chemical solution supplier, the sonic oscillator, and the home port, wherein the controller controls the ultrasonic nozzle to vibrate the chemical solution applied on the substrate during a cleaning period, and controls the ultrasonic nozzle to vibrate in the home port during a standby period to remove particles adhering to the ultrasonic nozzle.
A substrate processing apparatus comprising:
A substrate processing apparatus comprising:
A method for driving a substrate processing apparatus, the method comprising:
Dependencies are inferred from the claim text.