Substrate surface treatment for stiffener bonding
AssigneeIntel Corporation
InventorThien Bao HOANG
Life of this patent
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Abstract
A device package and a method of forming a device package are described. The device package includes a substrate and a stiffener. A portion of a top surface of the substrate is treated prior to stiffener attachment to change a profile of the portion. An adhesive material applied between a bottom surface of the stiffener and the treated substrate creates a more durable bond when attaching the stiffener to the substrate. An in-line process to treat the substrate to change the profile includes marking the portion of the top surface with a pattern and/or a barrier that creates a texture that improves surface wettability and effectiveness of adhesive material filling, and reduces defects in the device package, including stiffener delamination.
Claims14
A device package, comprising:
- a substrate;
- a stiffener having one or more parts prone to failure to bond with the substrate;
- a portion of a top surface of the substrate treated to change a profile of the portion;
- an adhesive material applied between a bottom surface of the stiffener and a stiffener area on the top surface of the substrate;
- and
- the stiffener bonded to the stiffener area on the substrate, the stiffener area encompassing the portion having the changed profile.
A computing device, comprising:
- a processor;
- a device package, wherein the device package includes:
- a substrate;
- a stiffener having one or more parts prone to failure to bond with the substrate;
- a portion of a top surface of the substrate treated to change a profile of the portion;
- an adhesive material applied between a bottom surface of the stiffener and a stiffener area on the top surface of the substrate;
- and
- the stiffener bonded to the stiffener area on the substrate, the stiffener area encompassing the portion having the changed profile.
Dependencies are inferred from the claim text.