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AssigneeQUALCOMM Incorporated
InventorsJiaping Zhang, Chenliang Du, Yuanzheng Yue, Sameer Sunil Vadhavkar, Anirudh Bhat
Estimating the term…
Passive components formed in the metal layers on the front side of a semiconductor die, where active circuit components are formed, can occupy a relatively large area of an integrated circuit (IC). Since cost of an IC is directly dependent on area, reducing area of passive components on the front side of the semiconductor die can reduce the cost of the IC. An exemplary integrated circuit including a power amplifier circuit on a first side and a passive electronic component on a second side can reduce overall size and cost. The passive electronic component is coupled to the power amplifier circuit by through-die vias extending through the semiconductor die between the first side and the second side. In some examples, the passive electronic component is an inductor coil formed in metal layers on the second side of the semiconductor die. In some examples, the semiconductor die is a gallium arsenide (GaAs) substrate.
An integrated circuit (IC) comprising:
A method of making an integrated circuit (IC), the method comprising:
A device package comprising:
Dependencies are inferred from the claim text.