Bonding structure and manufacturing method thereof

A manufacturing method of a bonding structure, comprising:

• providing a first structure portion, the first structure portion comprising:
• a first substrate;
• a first base portion, disposed on a side of the first substrate;
• a first connection portion, disposed on the other side of the first base portion with respect to the first substrate, wherein the first base portion and the first connection portion have a same conductive material, and activity of the first connection portion is greater than activity of the first base portion;
• and
• a first isolation layer, disposed on the same side of the first substrate as the first base portion, and surrounding the first base portion and the first connection portion;
• providing a second structural portion, the second structure portion comprising:
• a second substrate;
• a second base portion, disposed on a side of the second substrate;
• a second connection portion, disposed on a side of the second base portion, wherein the second base portion and the second connection portion have a same conductive material, and activity of the second connection portion is greater than activity of the second base portion;
• and
• a second isolation layer, disposed on the same side of the second substrate as the second base portion, and surrounding the second base portion and the second connection portion;
• and
• docking the other side of the first connection portion with respect to the first base portion with the other side of the second connection portion with respect to the second base portion to connect the first structure portion and the second structure portion.