Chip production method and cutting device

A cutting device for producing a plurality of chips by dividing a substrate having a first surface and a second surface opposite to the first surface along a plurality of planned dividing lines set in a lattice pattern on the substrate, the cutting device comprising:

• a holding table configured to hold the second surface of the substrate such that the first surface of the substrate is exposed;
• a cutting unit including a cutting blade configured to move the cutting blade relative to the substrate along the planned dividing lines to cut the substrate;
• and
• a controller configured to control the holding table and the cutting unit, wherein
• the cutting unit further includes an ultrasonic vibrator capable of vibrating the cutting blade at a vibration frequency in an ultrasonic band, and
• the controller executes a process of
• cutting the substrate along each of the planned dividing lines by rotating the cutting blade in a down-cut direction from the first surface toward the second surface while vibrating the cutting blade at a vibration frequency in an ultrasonic band, thereby forming a cutting groove on the first surface that does not reach the second surface, and
• cutting an uncut portion of the planned dividing line where the cutting groove is formed by rotating the cutting blade in an up-cut direction from the second surface toward the first surface, after the cutting groove is formed.