US 2026/0182276 A1 · METHOD FOR TREATING SUBSTRATES

Abstract

A method for treating substrates comprises: a step of treating a first substrate comprising at least one step carried out in an apparatus carrying out a thermal treatment, the first substrate being a substrate made of a semiconductor material or of a piezoelectric material; a step of decontaminating the apparatus carrying out a thermal treatment by a thermal treatment of a decontamination substrate, in particular, a silicon substrate; and then a step of treating a second substrate comprising at least one step carried out in the apparatus carrying out a thermal treatment, the first substrate being a substrate made of a semiconductor material or of a piezoelectric material.

Claims21

Dependent claims

A method of treating substrates, comprising:

a stage of treating a first substrate comprising at least one stage carried out in an item of equipment carrying out a heat treatment, the first substrate being a substrate comprising a semiconductor material or a piezoelectric material;
subsequently, a decontamination stage of reduction in a level of contamination of the item of equipment by a contaminating metal element by carrying out a heat treatment of a decontamination substrate;
and
subsequently, a stage of treating a second substrate comprising at least one stage carried out in the item of equipment, the second substrate being a substrate comprising a semiconductor material or a piezoelectric material.

1 more element

Dependencies are inferred from the claim text.

Method for treating substrates

Life of this patent

Method for treating substrates

Life of this patent

Abstract

Claims21