Thermoelectric module

Abstract

A thermoelectric module according to an embodiment of the present invention includes: a cooling jacket with through-holes through which fluid can flow; a first thermoelectric element disposed on the cooling jacket; and a first shield member disposed on the first thermoelectric element and being thermally conductive, wherein the first thermoelectric element includes: a first substrate; a semiconductor device disposed on the first substrate; a second substrate disposed on the semiconductor device; a first electrode disposed between the first substrate and the semiconductor device; and a second electrode disposed between the second substrate and the semiconductor device, and the first shield member includes an overlapping portion disposed in a region where the first electrode and the second electrode overlap.

Dependencies are inferred from the claim text.