Power module
AssigneeSemiconductor Components Industries, LLC
InventorsYushuang YAO, Chee Hiong CHEW, Vemmond Jeng Hung NG, Chuncao NIU, Sravan VANAPARTHY
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Abstract
A method includes attaching a power electronic substrate to a bottom of a frame. The frame has a box-like rectangular shape with an open top and an open bottom. The method further includes disposing an external conductive terminal on the frame. The external conductive terminal has at least one terminal stub that extends on to the front surface of the power electronic substrate. The method further includes welding the at least one terminal stub to at least one circuit trace disposed on the front surface of the power electronic substrate.
Claims20
A power module, comprising:
- a frame having a base and at least one sidewall extending from the base of the frame and defining a cavity;
- and
- a power electronic substrate attached to the base of the frame, a bottom surface of the power electronic substrate being exposed through an opening in the base of the frame.
A power module comprising:
- a frame including a base and a sidewall extending from the base and defining a cavity;
- a first power electronic substrate directly attached to the base of the frame with a front surface of the first power electronic substrate being exposed to the cavity and at least one first circuit trace disposed on the front surface of the first power electronic substrate, wherein a bottom surface of the first power electronic substrate is exposed through a first opening in the base of the frame;
- and
- a second power electronic substrate directly attached to the base of the frame with a front surface of the second power electronic substrate being exposed to the cavity and at least one second circuit trace disposed on the front surface of the second power electronic substrate, wherein a bottom surface of the second power electronic substrate is exposed through a second opening in the base of the frame.
A method, comprising:
- attaching a power electronic substrate to a base of a frame in a power module, the frame having at least one sidewall extending from the base of the frame, wherein a bottom surface of the power electronic substrate is exposed through an opening in the base of the frame;
- and
- attaching a thermally conductive base plate to the bottom surface of the power electronic substrate that is exposed through the opening.
Dependencies are inferred from the claim text.