Semiconductor Device And Electronic Apparatus
AssigneeSeiko Epson Corporation
InventorSatoru IMAI
Life of this patent
Estimating the term…
Loading patent…
AssigneeSeiko Epson Corporation
InventorSatoru IMAI
Estimating the term…
A semiconductor device includes a first terminal that is bonded to a first pad or a fourth pad, a second terminal that is bonded to a second pad or a fifth pad, a third terminal that is bonded to a third pad or a sixth pad, and a control section. The control section sets the third terminal to a terminal to which a low-speed signal propagates when a semiconductor device is mounted on a first printed circuit board provided with the first pad, the second pad, and the third pad, and sets the third terminal to a terminal to which a high-speed signal propagates when the semiconductor device is mounted on a second printed circuit board provided with the fourth pad, the fifth pad, the sixth pad, a fourth wiring and a fifth wiring respectively coupled to the fourth pad and the fifth pad and being at a ground potential, and a sixth wiring coupled to the sixth pad and positioned between the fourth wiring and the fifth wiring.
A semiconductor device that is mountable on a first printed circuit board or a second printed circuit board,
An electronic apparatus comprising:
Dependencies are inferred from the claim text.