Composite ceramic substrate and method for producing the same

A method for producing a composite ceramic substrate, comprising:

• a first printing process implemented by printing a first active metal layer onto a ceramic board and then printing a solder layer onto the first active metal layer, wherein the first active metal layer includes titanium hydride, and wherein the solder layer includes tin, copper, and titanium hydride;
• a second printing process implemented by printing a second active metal layer onto a circuit board, wherein the second active metal layer includes tin, copper, and titanium hydride;
• an assembling process implemented by assembling one side of the circuit board having the second active metal layer formed thereon to one side of the ceramic board having the first active metal layer and the solder layer formed thereon;
• and
• a sintering process implemented by sintering the circuit board, the first active metal layer, the second active metal layer, the solder layer, and the ceramic board that are assembled to form a composite ceramic substrate.