Electronic component

An electronic component comprising:

• a first conductor layer;
• a first resin layer embedding therein the first conductor layer;
• a second conductor layer formed on an upper surface of the first resin layer or an upper surface of another resin layer that covers the first resin layer;
• a second resin layer that covers an upper surface of the first resin layer so as to embed therein the second conductor layer;
• and
• a terminal electrode formed on an upper surface of the second resin layer,
• wherein the first conductor pattern includes a first conductor pattern,
• wherein the second conductor layer includes a second conductor pattern,
• wherein the first conductor pattern includes a first support part that overlaps the terminal electrode at least at a part thereof and first and second coil parts connected to the first support part without overlapping the terminal electrode,
• wherein the second conductor pattern includes a second support part that overlaps the terminal electrode and is connected to the terminal electrode through a via formed in the second resin layer and a third coil part connected to the second support part without overlapping the terminal electrode,
• wherein the first and second coil parts are electrically connected to each other through the first support part, and
• wherein the first support part is entirely covered with the first resin layer.