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US 2026/0177874 A1Published application
Optical devices and methods of manufacture
AssigneeTaiwan Semiconductor Manufacturing Company, Ltd.
InventorsChia-Han Tsou, Ming-Fa Chen
Life of this patent
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Abstract
A method of forming an optical device as well as the optical device itself are described herein in which a modulator device is bonded to a photonic integrated circuit. The photonic integrated circuit has a modulator that can be used to modulate optical signals from the photonic integrated circuit and the modulator is formed using lithium niobate.
Claims20
A method of forming an optical device, the method comprising:
- forming a photonic integrated circuit comprising first optical components, the first optical components comprising waveguides connected to a coupler;
- bonding a first semiconductor device to the photonic integrated circuit;
- and
- bonding a modulating device to the photonic integrated circuit, the modulating device comprising a modulator with lithium niobate, wherein after the bonding the modulator is optically coupled to the waveguides.
1 more element
A method of forming an optical device, the method comprising:
- bonding a first semiconductor device to a first side of a photonic integrated circuit, the photonic integrated circuit comprising couplers and waveguides;
- and
- bonding a modulator device to the photonic integrated circuit on an opposite side from the first semiconductor device, the modulator device comprising a lithium niobate film.
An optical device comprising:
- a modulator device comprising a lithium niobate film;
- a first waveguide located over the modulator device, the first waveguide in optical connection with the modulator device;
- a photonic integrated circuit bonded over the modulator device, the first waveguide being located between the modulator device and the photonic integrated circuit, the photonic integrated circuit comprising:
- a second waveguide optically connected to the first waveguide;
- a coupler optically connected to the second waveguide;
- and
- an electronic integrated circuit bonded over the photonic integrated circuit.
4 more elements
Dependencies are inferred from the claim text.