Curable composition and use of same
AssigneeKaneka Corporation
InventorsAkira Ogawa, Masaomi Sakabe, Ayako Yano
Life of this patent
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Abstract
The object is to provide, without use of an epoxy resin, a curable composition which has good workability and which has excellent adhesiveness even after an alkaline treatment. The object is attained by providing a curable composition containing: (A) 100 parts by weight of an organic polymer having a hydrolyzable silyl group; (B) 3 parts by weight to 35 parts by weight of at least one type of process oil selected from the group consisting of paraffinic process oils, naphthenic process oils, and aromatic process oils; (C) 20 parts by weight to 200 parts by weight of silica sand; and (D) 2 parts by weight to 10 parts by weight of a silane compound having an epoxy group and/or a silane compound having an amino group.
Claims7
A curable composition comprising:
- (A) 100 parts by weight of an organic polymer having a hydrolyzable silyl group;
- (B) 3 parts by weight to 35 parts by weight of at least one type of process oil selected from the group consisting of paraffinic process oils, naphthenic process oils, and aromatic process oils;
- (C) 20 parts by weight to 200 parts by weight of silica sand;
- (D) 2 parts by weight to 10 parts by weight of a silane compound having an epoxy group and/or a silane compound having an amino group.
Dependencies are inferred from the claim text.