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US 2026/0176499 A1Published application
Method for patterning an adhesive layer
AssigneeAvery Dennison Corporation
InventorsRishikesh BHARADWAJ, Vivek PANDEY, Zhouzhou ZHAO, Tien LY
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Abstract
This disclosure generally relates to patterning adhesives for use on rough substrates. More particularly, the disclosure relates to methods of patterning adhesives via a roll-to-roll process to promote super adhesion to rough substrates.
Claims20
A method for patterning an adhesive layer comprising:
- providing a liner having a first side, a second side, a first edge, and a second edge;
- contacting the first side of the liner with a deforming member to deform the liner at least temporarily through contact with the deforming member;
- and
- substantially simultaneously when the liner is at least temporarily deformed applying an adhesive in a manner that is substantially uniform to at least a portion of the first side of the liner but less than an entirety of the first side of the liner while the liner is temporarily deformed forming a pattern of adhesive;
- and
- whereby contact of the pattern of adhesive with a rough substrate leads to enhanced adhesion on the rough substrate with less adhesive than a continuous flood coat.
3 more elements
Dependencies are inferred from the claim text.