Prepreg, laminated plate, printed wiring board, and semiconductor package

Abstract

Provided is a prepreg or the like which has reduced adhesiveness between prepregs despite the fact that the prepreg contains a compound having a structural unit derived from a conjugated diene compound. Specifically, the prepreg is a prepreg having a concave-convex shape on the surface, the prepreg containing a thermosetting resin composition having (A) a thermosetting resin and (B) a compound having a structural unit (b1) derived from a conjugated diene compound, or a semi-cured product of the thermosetting resin composition, in which an existing ratio of a concave portion in the concave-convex shape is 30 to 90%.

Dependencies are inferred from the claim text.