Polishing pad, polishing method, and method of manufacturing polishing pad

A method of manufacturing a polishing pad, the method comprising introducing an uncured resin into a coaxial centrifugal molding apparatus, forming an uncured resin layer on an inner circumferential surface of the coaxial centrifugal molding apparatus with a centrifugal force, and heating and curing the uncured resin layer to produce a resin sheet,

• wherein the resin sheet has a plurality of bubbles,
• wherein, when a plurality of cross-sections, which are parallel to a surface on a side for polishing an object to be polished, are determined every 4 μm in a depth direction toward a surface on a side opposite to the surface on the side for polishing the object to be polished from a measurement result of X-ray CT of the resin sheet, and a total value of areas of openings of recesses derived from the plurality of bubbles per unit area in each of the plurality of cross-sections is defined as a bubble area ratio, the resin sheet has, out of the plurality of cross-sections, a surface where the bubble area ratio is maximum,
• wherein, in the surface where the bubble area ratio is maximum, an average aspect ratio of the openings of the recesses derived from the plurality of bubbles is 1.00 or more and 2.00 or less,
• wherein, in the surface where the bubble area ratio is maximum, a total value of area-equivalent circle diameters of the openings of the recesses derived from the plurality of bubbles per unit area is 9.0 mm/mm2 or more and 61.0 mm/mm2 or less, and
• wherein, in the surface where the bubble area ratio is maximum, the bubble area ratio is 55 area % or more and 95 area % or less.