Semiconductor device
AssigneeRenesas Electronics Corporation
InventorYoshihiro MASUMURA
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AssigneeRenesas Electronics Corporation
InventorYoshihiro MASUMURA
Estimating the term…
substrate; a first insulating layer formed on the semiconductor substrate; first and second coils formed on the first insulating layer and located adjacent to each other in plan view; a first conductor pattern formed on the semiconductor substrate, extending in a second direction perpendicular to a first direction in plan view, and formed between the first coil and the second coil in the first direction; a second insulating layer formed on the first insulating layer so as to cover the first coil, the second coil, and the first conductor pattern; third and fourth coils formed on the second insulating layer and respectively overlapping the first and second coils in plan view. Here, the first direction is an arrangement direction of the first coil and the second coil. Also, the first conductor pattern is electrically connected to the semiconductor substrate.
A semiconductor device comprising:
Dependencies are inferred from the claim text.