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US 2026/0173889 A1Published application
Systems And Methods For Providing Dynamic Security Fabric Interposers In Heterogeneously Integrated Systems
AssigneeThe Charles Stark Draper Laboratory, Inc.
InventorDouglas La Tulipe
Life of this patent
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Abstract
An integrated circuit (IC) package includes an interposer including one or more electrically active devices that actively control power delivery to one or more IC die. The interposer is coupled to the one or more IC die through an interconnection layer and coupled to a backside power delivery network of the IC package. The interposer distributes power from the backside power delivery network to the one or more IC die through the interposer.
Claims20
An integrated circuit (IC) package comprising:
- an interposer including one or more electrically active devices that actively control power delivery to one or more IC die, the interposer being coupled to the one or more IC die through an interconnection layer and coupled to a backside power delivery network of the IC package,
- wherein the interposer distributes power from the backside power delivery network to the one or more IC die through the interposer.
A method of manufacturing an integrated circuit (IC) package, comprising:
- forming an interposer including electrically active devices;
- coupling the interposer to a backside power delivery network;
- and
- mounting one or more IC die to a front side of the interposer through an interconnection layer,
- wherein the interposer is configured to distribute power from the backside power delivery network to the one or more IC die.
2 more elements
Dependencies are inferred from the claim text.