Interconnect structure, electronic device including the same, and electronic apparatus including the same

An electronic device, comprising

• a plurality of components,
• wherein the plurality of components comprises a transistor, a capacitor, a diode, a resistor, or a combination thereof, and an interconnect structure disposed at a connection portion between the plurality of components or at a connection portion within each component,
• wherein the interconnect structure comprises
• a substrate,
• a metal layer on the substrate, and
• a capping layer in contact with the metal layer and including a nickel-cobalt alloy,
• wherein the nickel-cobalt alloy has a hexagonal crystal structure.

An electronic device, comprising

• a plurality of units of a memory unit, an arithmetic logic unit, and a control unit,
• wherein the plurality of units comprises a transistor, a capacitor, a diode, a resistor, or a combination thereof,
• wherein an interconnect structure is disposed at a connection portion between the plurality of units or at a connection portion within each unit,
• the interconnect structure comprises
• a substrate,
• a metal layer on the substrate, and
• a capping layer in contact with the metal layer and including a nickel-cobalt alloy, and
• the nickel-cobalt alloy has a hexagonal crystal structure.