Roof removal for oled device

A device, comprising:

• a substrate;
• and
• a plurality of sub-pixels defined by adjacent pixel structures, each sub-pixel comprising:
• the adjacent pixel structures disposed over the substrate, wherein each pixel structure comprises a first structure disposed over the substrate;
• an anode;
• an organic light emitting diode (OLED) material disposed over the anode;
• a cathode disposed over the OLED material;
• and
• an encapsulation layer disposed over the cathode, the encapsulation layer having an encapsulation overhang, the encapsulation overhang extends from a sidewall of the first structure and has an upper surface coplanar with a top surface of the first structure, the encapsulation layer having a gap between the encapsulation overhang and a portion of the encapsulation layer disposed over the cathode;
• a panel cover layer disposed over the plurality of sub-pixels, wherein the panel cover layer is disposed on the upper surface of the first structure and the upper surface of the encapsulation overhang;
• and
• a global passivation layer disposed over the panel cover layer.

A method of forming a device, comprising:

• disposing a first resist in a plurality of sub-pixels of a sub-pixel circuit, wherein the sub-pixel circuit are defined by adjacent pixel structures, each sub-pixel comprising:
• the adjacent pixel structures comprising:
• a first structure disposed over a substrate;
• and
• a second structure disposed over a first structure, wherein the second structure comprises an overhang extension extending laterally past an upper surface of a first structure to form an overhang;
• an anode;
• an organic light emitting diode (OLED) material disposed over the anode, wherein the OLED material is disposed under the overhang and extends to contact a sidewall of the first structure;
• a cathode disposed over the OLED material, wherein the cathode is disposed under the overhang;
• and
• an encapsulation layer disposed over the cathode, wherein the encapsulation layer is disposed under the overhang and extends past an endpoint of the cathode to contact the sidewall of the first structure;
• removing a portion of the first resist to expose a portion of the encapsulation layer;
• removing the portion of the encapsulation layer that is exposed by the first resist to expose the second structure;
• removing the first resist;
• disposing a second resist in the plurality of sub-pixels;
• removing a portion of the second resist to expose the second structure;
• removing the second structure exposed by the second resist;
• and
• removing the second resist.