Micro-led display co-packaged with optics and method of fabrication
AssigneeHyperlume Inc.
InventorsMOHSEN ASAD, HOSSEIN FARIBORZI
Life of this patent
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Abstract
A display including light emitting diodes (LEDs) fabricated on an LED wafer, light reflecting sidewalls coating side surfaces of each of the LEDs, and LED bonding pads fabricated on the LED wafer. The LED bonding pads being electrically connected to the LEDs. The display also including a color conversion optical wafer bonded to the LED wafer to covert light emitted from the LEDs, a light manipulating optical wafer bonded to the color conversion optical wafer to manipulate the converted light emitted from the color conversion optical wafer, and LED driver circuits including driver circuit bonding pads bonded to the LED bonding pads to electrically connect the LED driver circuits to the LEDs.
Claims26
A display comprising:
- light emitting diodes (LEDs) fabricated on an LED wafer, light reflecting sidewalls coating side surfaces of each of the LEDs, and LED bonding pads fabricated on the LED wafer, the LED bonding pads being electrically connected to the LEDs;
- an color conversion optical wafer bonded to the LED wafer to covert light emitted from the LEDs;
- a light manipulating optical wafer bonded to the color conversion optical wafer to manipulate the converted light emitted from the color conversion optical wafer;
- and
- LED driver circuits including driver circuit bonding pads bonded to the LED bonding pads to electrically connect the LED driver circuits to the LEDs.
A method of manufacturing a display, the method comprising:
- fabricating light emitting diodes (LEDs) on an LED wafer;
- fabricating light reflecting sidewalls coating side surfaces of each of the LEDs;
- fabricating LED bonding pads on the LED wafer, the LED bonding pads being electrically connected to the LEDs;
- fabricating a color conversion optical wafer bonded to the LED wafer to covert light emitted from the LEDs;
- fabricating a light manipulating optical wafer bonded to the color conversion optical wafer to manipulate the converted light emitted from the color conversion optical wafer;
- temporarily connecting the LED bonding pads to a test circuit and confirming operation of the LEDs;
- removing the LED bonding pads from the test circuit when operation of the LEDs are confirmed;
- and
- aligning and electrically connecting the LED bonding pads to driver bonding pads of LED driver circuits to electrically connect the LED driver circuits to the LEDs.
A display comprising:
- light emitting diodes (LEDs) fabricated on an LED wafer, light reflecting sidewalls coating side surfaces of each of the LEDs, and LED bonding pads fabricated on the LED wafer, the LED bonding pads being electrically connected to the LEDs;
- an color conversion optical wafer bonded to the LED wafer to covert light emitted from the LEDs;
- and
- a light manipulating optical wafer bonded to the color conversion optical wafer to manipulate the converted light emitted from the color conversion optical wafer.
A method of manufacturing a display, the method comprising:
- fabricating light emitting diodes (LEDs) on an LED wafer;
- fabricating light reflecting sidewalls coating side surfaces of each of the LEDs;
- fabricating LED bonding pads on the LED wafer, the LED bonding pads being electrically connected to the LEDs;
- fabricating a color conversion optical wafer bonded to the LED wafer to covert light emitted from the LEDs;
- and
- fabricating a light manipulating optical wafer bonded to the color conversion optical wafer to manipulate the converted light emitted from the color conversion optical wafer.
Dependencies are inferred from the claim text.